Ablation uses a 2 or 3 or 5-axis scanner to remove precise layers of material.
Typically used for texturing, coating removal, or aerospace diffusers.
A range of laser sources paired with scanner assemblies is available to suit the applications and material. Laser sources are available from microsecond down to femtosecond pulse widths.
µDRILL provides a high-speed micro-hole drilling application used for drilling small holes at a very fast rate. Typically in stainless steel or plastic substrates.
Rapid processing of metallic and plastics substrates or foils. Able to achieve ~3000 holes per second.
A wide range of standard and optional features are available from in-built probing to integrated vision systems and lighting to suit the application being processed. The system is also automated read out of the box.