This small form factor machine is designed with modularity in mind. Choose from laser micro-machining, welding, cutting, or micro-drilling applications to configure the right solution.
Choose the right laser source – CW or nano to femtosecond pulsed in multiple wavelengths.
Configurable for 2 & 3 Axis Scanners or hard optic beam delivery.
Customizable system can be configured as a 3,4 or 5-axis configuration to fit your needs.
Available with integrated power meters, probes, vision systems, and proccess monitoring.
907 kg (2000 lbs)
Use a 2 or 3-axis galvo scanner to move the laser and micro-machine or ablate your material. Laser wavelength and pulse width are applied to meet process needs with 5-axis machine motion for laser texturing or infinite field of view.
CW, QCW & other laser sources to be tailored for the end application. In-Process Process Monitoring for quality assurance. Vision system integration for pre and post-process inspection.
Micro hole drilling able to achieve 2000 holes per second through multiple materials and foils. Acheiving hole diameters down to 0.010mm including shaped holes for customer applications.