THE 200 SERIES
A MODULAR Laser PLATFORM

This small form factor machine is designed with modularity in mind. Choose from laser micro-machining, welding, cutting, or micro-drilling applications to configure the right solution.

ANY LASER SOURCE

Choose the right laser source – CW or nano to femtosecond pulsed in multiple wavelengths.

BEAM DELIVERY

Configurable for 2 & 3 Axis Scanners or hard optic beam delivery.

MOTION

Customizable system can be configured as a 3,4 or 5-axis configuration to fit your needs.

built-in options

Available with integrated power meters, probes, vision systems, and proccess monitoring.

TECHNICAL SPECIFICATIONS of THE 200 SERIES

External Dimensions (LxWxH)

W: 762 mm (30 in)
L: 1220 mm (48 in)
H: 1905 mm (75 in)

Machine Weight

907 kg (2000 lbs)

Machine Stroke (X.Y.Z)

Linear X Axis 250 mm (9.8 in)
Linear Y Axis 250 mm (9.8 in)
Linear Z Axis 250 mm (9.8 in)

Rotary Stroke (A.C)

Rotary A Axis + 10°/ – 145°
Rotary C Axis +/- 360°

Weight Capacity

3-Axis – 45 kg
5 Axis – 5 kg

THE NEXT GENERATION
OF LASER MACHINE TOOLS

ABLATE

Use a 2 or 3-axis galvo scanner to move the laser and micro-machine or ablate your material. Laser wavelength and pulse width are applied to meet process needs with 5-axis machine motion for laser texturing or infinite field of view.

uWELD

CW, QCW & other laser sources to be tailored for the end application. In-Process Process Monitoring for quality assurance. Vision system integration for pre and post-process inspection.

uDRILL

Micro hole drilling able to achieve 2000 holes per second through multiple materials and foils. Acheiving hole diameters down to 0.010mm including shaped holes for customer applications.

THE HIGHLIGHTS

let’s talk about your manufacturing needs