THE 200 SERIES

MODULAR LASER PLATFORM

This small form factor machine is designed with modularity in mind. Choose from laser micro-machining, welding, cutting, or micro-drilling applications to configure the right solution.

THE 200 SERIES

MODULAR LASER PLATFORM

This small form factor machine is designed with modularity in mind. Choose from laser micro-machining, welding, cutting, or micro-drilling applications to configure the right solution.

EXPLORE THE PLATFORM
 

TECHNICAL SPECIFICATIONS

External Dimensions (LxWxH)

W: 762 mm (30 in)
L: 1220 mm (48 in)
H: 1905 mm (75 in)

Machine Weight

907 kg (2000 lbs)

Machine Stroke (X.Y.Z)

Linear X Axis 250 mm (9.8 in)
Linear Y Axis 250 mm (9.8 in)
Linear Z Axis 250 mm (9.8 in)

Rotary Stroke (A.C)

Rotary A Axis + 10°/ – 145°
Rotary C Axis +/- 360°

Weight Capacity

3-Axis -45 kg

5-Axis – 5 kg

THE 200 SERIES HIGHLIGHTS

  • Industry leading platform for advanced laser-micro machining with the latest laser technology.
  • Customizable options that are tailored to your processing needs and budget, with multiple laser sources and scanning options.
  • Optimize space with this compact 76 cm (30 in) wide machine, ideal for manufacturing cells.
  • Achieve consistent production with the integrated laser power meter that ensures uniform part production.
  • Renishaw probing for part, fixture, and machine geometric correction
  • Industry 4.0 compatible, tracking real-time and historical in-process data to optimize production.

THE 200 SERIES HIGHLIGHTS

  • Industry leading platform for advanced laser-micro machining with the latest laser technology.
  • Customizable options that are tailored to your processing needs and budget, with multiple laser sources and scanning options.
  • Optimize space with this compact 76 cm (30 in) wide machine, ideal for manufacturing cells.
  • Achieve consistent production with the integrated laser power meter that ensures uniform part production.
  • Renishaw probing for part, fixture, and machine geometric correction
  • Industry 4.0 compatible, tracking real-time and historical in-process data to optimize production.

THE NEXT GENERATION

OF LASER MACHINE TOOLS

THE NEXT GENERATION OF LASER MACHINE TOOLS

ABLATE

Use a 2 or 3-axis galvo scanner to move the laser and micro-machine or ablate your material. Laser wavelength and pulse width are applied to meet process needs with 5-axis machine motion for laser texturing or infinite field of view.

uWELD

CW, QCW & other laser sources to be tailored for the end application. In-Process Process Monitoring for quality assurance. Vision system integration for pre and post-process inspection.

uDRILL

Micro hole drilling able to achieve 2000 holes per second through multiple materials and foils. Acheiving hole diameters down to 0.010mm including shaped holes for customer applications.

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