LASER MICRO

HIGH SPEED COUPLED WITH HIGH ACCURACY

Laser micro-machining pairs a nanosecond, picosecond, or femtosecond laser with a high-speed and high-accuracy scanner assembly that moves to beam at a speedy rate. Most scanner assemblies are 2 or 3-axis, however, some applications require more advanced options such as a 5-axis or polygon scanner.

Laser Ablation

µDRILL

LASER ABLATION

Ablation uses a 2 or 3 or 5-axis scanner to remove precise layers of material.
Typically used for texturing, coating removal, or aerospace diffusers.

High Speed Scanners

Using galvo mirrors and programmed toolpaths to achieve fast material removal of metallic and non-metallic materials.
laser ablation
laser micro-machining

Automation-Ready

Automation ready – Overhead or front loading with minimal operator intervention for lights-out operation. Paint-to-paint or transfer line configurations are available.

Highly Configurable

A range of laser sources paired with scanner assemblies is available to suit the applications and material. Laser sources are available from microsecond down to femtosecond pulse widths.

laser aperature

MICRO-DRILL

µDRILL provides a high-speed micro-hole drilling application used for drilling small holes at a very fast rate. Typically in stainless steel or plastic substrates.

Ultrahigh Speed

Rapid processing of metallic and plastics substrates or foils. Able to achieve ~3000 holes per second.

MICRO HOLES

Applications include processing 0.010 – 0.050 mm diameter holes on plates and foils ranging from 0.010 – 0.500 mm thick.

Feature-Packed

A wide range of standard and optional features are available from in-built probing to integrated vision systems and lighting to suit the application being processed. The system is also automated read out of the box. 

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