Material: Silicon
Application: Laser Micro
System: Ablate 200 Series
Winbro’s laser micro machining delivers precise dicing, cutting, and edge dressing of silicon wafers. The non-contact process ensures clean edges, minimal thermal damage, and consistent wafer quality.
Material: Stainless Steel
Application: Micro Machining
System: 100 Series
Laser micro machining technology produces high-accuracy micro features on semiconductor probe cards, essential for advanced packaging applications. The non-contact process ensures precise results while protecting the substrate from damage.
Material: Stainless Steel
Application: Micro Drilling
System: Automated Transfer Line
Winbro’s fast micro hole drilling process for fuel cell applications achieves an impressive 2,000–3,000 holes per second with exceptional accuracy and consistency. This capability supports the production of next-generation solid oxide and PEM fuel cells, enabling higher performance and efficiency.
Material: Silicon
Application: Micro Texturing
System: 100 Series
The laser-textured sample showcases seven distinct surface textures alongside the Winbro logo, demonstrating precision and versatility in design. This example highlights toolpath generation and the capability to micro machine complex textures using advanced laser processing.
Material: Copper
Application: Milling, EDM,
and Laser Micro Machining
System: Multiple
A copper cooling plate undergoes multiple precision processes—such as microchannel machining, EDM hole drilling, and surface finishing—to form a thermal heat-transfer unit tailored for server cooling systems.
This engineered cold plate efficiently conducts heat from high-power components into the coolant stream, enabling effective thermal management in dense compute environments.
